• Out-of-Stock
Printeasy solder Sn96,5Ag3Cu0,5 1,4 ml Pâte à souder pour montage en surface (SMD)
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  • Printeasy solder Sn96,5Ag3Cu0,5 1,4 ml Pâte à souder pour montage en surface (SMD)
  • Printeasy solder Sn96,5Ag3Cu0,5 1,4 ml Pâte à souder pour montage en surface (SMD)
  • Printeasy solder Sn96,5Ag3Cu0,5 1,4 ml Pâte à souder pour montage en surface (SMD)

Printeasy solder Sn96,5Ag3Cu0,5 1,4 ml Pâte à souder pour montage en surface (SMD)

€5.75

Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.

Quantity
Out-of-Stock

Type du métal apporté
pour le brasage tendre
Forme
pâte
Composition de l'alliage
Sn96,5Ag3Cu0,5
Genre de joint
sans plomb
Genre de la emballage
seringue
Dimension des granules
25...45µm
Masse du liant
8g
Point de fusion
217°C
Contenu du flux
15%
Genre du flux
No Clean, REL0, sans halogènes
Volume
1.4ml
SOLDSN028
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