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Printeasy solder Sn96,5Ag3Cu0,5 1,4 ml Pâte à souder pour montage en surface (SMD)
€6.90
Tax included
Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.
|
Type du métal apporté
|
pour le brasage tendre | |
|
Forme
|
pâte | |
|
Composition de l'alliage
|
Sn96,5Ag3Cu0,5 | |
|
Genre de joint
|
sans plomb | |
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Genre de la emballage
|
seringue | |
|
Dimension des granules
|
25...45µm | |
|
Masse du liant
|
8g | |
|
Point de fusion
|
217°C | |
|
Contenu du flux
|
15% | |
|
Genre du flux
|
No Clean, REL0, sans halogènes | |
|
Volume
|
1.4ml |
SOLDSN028
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Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.