14-pin DIP IC socket with double-wipe spring contacts and double-sided clamping plate. 2.54 mm pitch and 7.62 mm row spacing, through-hole mounting.
14-pin Dual In-line Package (DIP) socket with "double wipe" spring-contact mechanism, designed for repeated insertion and removal of integrated circuits without soldering.
This Through-Hole Technology (THT) socket allows easy installation of microcontrollers or logic chips on prototyping boards. The double-sided clamping plate ensures reliable contact with the IC pins.
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14-pin DIP IC socket with double-wipe spring contacts and double-sided clamping plate. 2.54 mm pitch and 7.62 mm row spacing, through-hole mounting.
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